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NO TEST ITEM TEST CONDITIONS DURATION REFERENCED DOCUMENT
1 SOLDER ABILITY 230¡ã ¡À5¡ãC 5 SEC

MIL-STD-202

METHOD 208

2 LEAD PULL 2KG IN AXIAL LEAD DIRECTION 10 SEC

MIL-STD-750

METHOD-2036

3 LEAD FATIGUE 90-DEGREE BEND WITH 0.5KG WEIGHT ATTACHED TO LEAD 3 TIMES

MIL-STD-750

METHOD-2036

4 OPERATING LIFE RATED CURRENT @55¡ãC 168/1000 HRS

MIL-STD-750C

METHOD 1027

RATED VOLTAGE
5 HIGH TEMPERATURE REVERSE BIAS 80% RATED VOLTAGE 125¡ãC FOR STD TYPE 168/1000 HRS

MIL-STD-750

METHOD 1038

            150¡ãC FOR GPP TYPE
6 INTERMITTNET OPERATING LIFE ON:5MIN WITH RATED IRMS POWER 1000 CYCLES

MIL-STD-750

METHOD-1036

OFF:5MIN WITH COOL FORCED     AIR
7 FORWARD SURGE CURRENT 8.3ms SINGLE HALF SINE-WAVE SUPERIMPOSED ON RATED LOAD 1 PULSE

MIL-STD-750

METHOD 4066

8 HIGH TEMPERATURE STORAGE LIFE TSTG(max) 168/1000 HRS

MIL-STD-750

METHOD 1031

9 LOW TEMPERATURE STORAGE LIFE TSTG(min) 168/1000 HRS

IEC-68-2-1

TEST A COLD

10 MOISTURE RESISTANCE 85¡ãC£¬85%RELATIVE HUMIDITY 168/1000 HRS

MIL-STD-750

METHOD 1021

11 PRESSURE COOKER 15PSIG,121¡ãC 4 HRS

MIL-S-19500

APPENDIX C

12 THERMAL SHOCK 0¡ãC/5 MIN,100¡ãC/5 MIN 10 CYCLES

MIL-STD-750

METHOD 1056

13 TEMPERATURE CYCLING TSTG(max)/15 MIN TSTG(min)/15 MIN 25¡ãC/5 MIN FOR TRANSFER 10 CYCLES

MIL-STD-750

METHOD 1051

14 SOLDERING HEAT 260¡ãC+5¡ãC-0¡ãC

10SEC

MIL-STD-750

METHOD 2031

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